3D ICs Market Analysis - Global Industry Size, Share, Trends and Forecast, 2021-2030

Category : Semiconductor and Electronics | Delivery Format : PDF | Status: Forthcoming | Report ID : ARC151

Rising awareness for energy efficient and propagation of IoT-based devices is encouraging several manufacturing organizations to improve and innovate their products with the help of 3D ICs.

3D IC is an advanced technology that facilitates in designing & development of latest light weight and handy consumer goods by reducing the size of components used in these devices. Additionally, they provide better efficiency, speed, durability, and memory to these upcoming smart devices. As a result, 3D ICs are gaining popularity in numerous industry verticals, leading to dramatically rising growth in its demand, globally.

Furthermore, surge in demand for high-performance and compact ICs in desktop computers, tablets, mobile phones automotive products, smart TVs, and heavy equipment is anticipated to be one of the key factors driving the growth of 3D ICs market. Some of the other reasons behind its bolstering growth rate are the higher band width and better performance, which is now a day mandatory in the manufacturing of energy efficient devices such as 3D LEDs. Moreover, the up surging R&D expenditures and strategic partnerships among the Industry players is expected to increase the applications of these 3D ICs. Although this technology has become a key component of the trending smart devices, its feasibility and lack of supporting IT infrastructure has led to certain issues with thermal and testing glitches, which are expected to restrict the market during the forecast period. Further, the rising demand for automated products and high functionality devices will be motivating myriad OEMs to integrate 3D ICs along with their devices, which would eventually generate new opportunities for the market.

The 3D ICs market is broadly segment into substrate types, components, fabrication processes and the end-user industry. There are two kinds of substrate types viz., SOI (Silicon On Insulator) and bulk silicon. The Silicon-on-Insulator is capable of cutting down the excessive heat production & scrounging capacitance, resulting in high demand of SOI substrate type. Thus, SOI is expected to capture the majority of the substrate revenue share in the coming years. Memories, sensors, MEMS, LED, and logic are some of the important fragments of components segment in the 3D ICs market. The growth in the memory segment is attributed by the growing demand for devices with extended memory along with improvising trends and technologies. Also, the LED products are expected to attain boosting growth rate due to rising demand in LED based devices such as LED lighting, LED backlights in various display units. Moreover, LED products consume the least power and offer better efficiency as compared to its competing technologies. The 3D memory segment is projected to dominate the market in coming years owing to the advancements in technology such as low power consumption and high storage capacity, which would increase the adoptability of DDR4 DRAM and 3D NAND in smart mobile devices and automotive products. According to the fabrication process, the market is fragmented into beam re-crystallization, silicon epitaxial growth, water bonding and solid phase crystallization. Due to its ability to produce thin ICs, water bonding is the highly utilized fabrication process.

Consumer electronics, ICT, and military are some of the major key application areas of 3D ICs. Based on different end-user applications, the 3D ICs market is anticipated to be dominated by the ICT sector owing to the higher adoption rate of 3D ICs integration technology. Another major segment for the application of 3D ICs is consumer electronics because of the increasing demand for compact and efficient consumer electronics products.

The global market is fragment into North America, Asia Pacific, Latin America, Middle East and Africa, and Europe. Presently Asia Pacific is estimated to be the fastest growing market followed by North America and Europe. Tezzaron Semiconductor Corporation, 3M Company, Xilinx, Samsung, United Microelectronics Corporation, Taiwan Semiconductor Manufacturing Company, Ltd., and STMicroelectronics amongst others are some of the key competitors in this market.

Market Segmentation

Market By Geography

North America
•    U.S.
•    Canada

•    U.K.
•    Germany
•    France
•    Spain
•    Rest of Europe

•    China
•    Japan
•    India
•    Australia
•    South Korea
•    Rest of Asia-Pacific

Latin America
•    Brazil 
•    Mexico
•    Rest of Latin America

Middle East & Africa
•    GCC
•    South Africa
•    Rest of Middle East & Africa

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