Category : Chemicals and Materials | Published at : January-2019 | Delivery Format : PDF | Status: Published | Pages : 160
Introduction
The global solder material market size is anticipated to around USD 2.2 billion by 2026, this market is anticipated to grow 4.5% CAGR during the forecast time period.
Rising populace and growing urbanization across the globe have been providing a fillip to the solder material market. Also, surge in the need for refurbished goods is expected to boost the development of the solder material market
Market Dynamics
Increasing demand for smart hardware and the coming of vitality effective gadgets are the main considerations expected to drive the market. Ordinary micrometer solder material in the paste display a few weaknesses, for example, high melting temperatures, which may result in undesired worry amid the reflow preparing, limited applications, and deformities in the joint. This has prompted the presentation of different sub-microns and nanoparticle-based patch materials.
Market Insights
Wave/reflow developed as the largest process segment and was valued at USD 376.6 million in 2018. It is one of the extensively used processes for soldering in the electronics sector as it eradicates the damage by overheating. Also, the process can be deployed for mass manufacturing, thus boosting the segment development.
Robotic process is among the quickest developing section as it gives a completely computerized arrangement. Laser and automated fastening have of late seen various progressions in ters of advances. Furthermore, presentation of cutting edge mechanical arrangements is relied upon to drive the section development.
Robotic process involves four machines including binding/desoldering gadget, adjust station, vacuum or sight-seeing pickup. This procedure gives continuous availability and can be gotten too remotely from various areas. Mechanical procedures are utilized in mass creation for enhanced execution and lower producing time, which is relied upon to drive the section.
Market Segmentation
Market By Product
- Wire
- Paste
Bar
Flux
Market By Process
- Screen-printing
- Robotic
- Laser
- Wave/Reflow
Market By Geography
- North America
- U.S.
- Canada
- Mexico
- Europe
- UK
- Germany
- France
- Rest of Europe
- Asia-Pacific
- China
- Japan
- India
- Australia
- Rest of Asia-Pacific
- Latin America
- Brazil
- Chile
- Rest of Latin America
- Middle East and Africa (MEA)
- South Africa
- Saudi Arabia
- Rest of MEA
Regional Insights
North America is the second-biggest local market after Asia Pacific because of quickly extending hardware and semiconductors industry. U.S. developed as the biggest market in North America area in 2017. This was ascribed to the development of the repairing business in the nation. Ascend in the creation of cutting edge semiconductor gadgets is relied upon to help the development further during the forthcoming years.
The business is required to enroll remarkable additions, fundamentally in Mexico, by virtue of an ascent in the assembling base for the gadgets business. Also, expanding number of electronic gadgets fixing outlets bringing about a huge improvement of hardware post-retail is assessed to help showcase development. Demand for such items in shopper gadgets is probably going to develop because of decrease in the gadget estimate, which is additionally expected to prompt the market development.
Main businesses in the market emphasis on emerging technologically advanced materials through research initiatives. They additionally endeavor to convey superior patch composites and raw materials that give progressed welded bonds in lesser time.
Market Participants
Market companies are concentrating on implementing new strategies for instance regional expansion, partnerships, mergers and acquisitions, new product launches, and distribution agreements to surge their revenue share. The major players associated with the solder material are Accurus, AIM, Alent (Alpha), DS HiMetal, Henkel, Indium, Inventec, KAWADA, Kester(ITW), KOKI, MKE, Nihon Superior, Nippon Micrometal, PMTC, Senju Metal, Shanghai hiking solder material, Shenmao Technology, Shenzhen Bright, Tamura, Tongfang Tech, Yashida, YCTC, and Yong An.
