Category : Semiconductor and Electronics | Published at : September-2020 | Delivery Format : PDF | Status: Published | Pages : 190
Acumen research and consulting estimates that the global thermal management market is anticipated to reach market size of around US$ 15,000 Mn by 2027 and is anticipated to grow at a CAGR of around 8% in terms of revenue during the forecast period 2020 – 2027. Excess heat is commonly extracted by electronic devices and circuits. Therefore, this excess heat requires thermal control in order to avoid errors and thereby increase efficiency. Various techniques are available, including several systems like conduction refrigeration devices, convection refrigeration systems, sophisticated models and hybrid refrigeration systems. For apps like electronics, computers and data centres, manufacturing, aviation and defense, and much more, thermal management can be carried out.
Market Insights
Thermal management demand in various consumer electronics, miniaturization of devices and various technological developments over the years are increasing, which contribute to the growth of the thermal management market. In addition, the development of the demand for thermal management fuels the growing developments in the electronic industry. However, the dynamics of thermal control components impede the growth of the overall market. The increased demand for solutions for thermal management directly depends on the growing demand for consumer electronics. Solutions are widely utilized among other things in laptops, gaming devices, tablets and smartphones. Processors and transistors are also protected against overheating. The technical challenges associated with the device and network, including the heat effect, are also the technological challenge for transistor operations. This problem is therefore expected in the forecast period to hinder the market growth.
Cool chips are an important cooling process, where chips serve as cooling elements in computers and vehicles for electronic devices. For instance, in the ICECool method of intra-chip / interchip cooling, chips are used in electronic devices to resolve issues of heat dissipation. This method is used to develop microfluid embedded systems. These microfluids are used in the early design phase to tackle thermal management challenges. This cooling technique is useful when designing and manufacturing micro-level chips to improve heat resistance and electronic device performance. Nanoscale optimized CMOS and embedded devices use chip-cooling for effective thermal control use complementary metal-oxide-semiconductor (CMOS).
Regionally, North-America accounted for the largest market share from countries such U.S. among others. The explanation for these solutions is the increased spending in thermal management technologies across various fields and the low running costs. However, over the projected period 2020-2027, Asia-Pacific is expected to grow. The main factor is that many electronics manufacturers are present, government initiatives are increasing and thermal solutions are increasingly being adopted in several sectors.
COVID-19 Impact on the Global Thermal Management Market
The thermal management market comprises major Tier 1 and Tier 2 suppliers, such as Honeywell International, Henkel, Laird, Delta Electronics, Vertiv, European Thermodynamics, Master Bond, Advanced Cooling Technologies and Parker. These manufacturers are assembled across Asia Pacific, Europe, North America , South America and RoW across different countries. Such firms produce thermal control products in end-use markets, including vehicles, consumer electronics, servers , data centers, healthcare and many more. COVID-19 not only affected the thermal management activities of the various industries, but also affected the companies of the industries mentioned above. Owing to shutdown initiatives, low demand for consumer electronic devices had a global impact on the thermal management market. The steady drop in global demand and export shipments for vehicles is also expected to adversely affect the thermal management market. However, the thermal management market is expected to recover as the healthcare sector raises competition. In the context of these pandemics, rising demand for personal tracking equipment is anticipated to push the market.
Key Players
Major players included in this report are Honeywell International Inc., PARKER HANNIFIN CORP, Delta Electronics, Inc., Kelvion Holding GmbH, Master Bond Inc., Henkel AG & Co. KGaA, LORD Corporation., Laird, HEATEX AB, AI Technology, Inc., GENTHERM, Miba AG, European Thermodynamics Ltd., INHECO Industrial Heating & Cooling GmbH, Boyd Corporation, ThermoTek, API Heat Transfer, Vertiv Group Corp., Aismalibar, Cool Innovations, and others. The market for thermal management technology is highly fragmented and there is no significant market share for any player. In fact, there is an rise in the number of local players, which contributes to intensified rivalry.
The global thermal management market is segmented as below:
Market Segmentation
Thermal Management Market By Material
Adhesive Material
Nonadhesive Material
Thermal Management Market By Device
Conduction Cooling Devices
Convection Cooling Devices
Advanced Cooling Devices
Hybrid Cooling Devices
Thermal Management Market By Service
Installation & Calibration
Optimization & Post-sales Support
Thermal Management Market By End-use Industry
Aerospace & Defense
Automotive
Servers & Data Centers
Consumer Electronics
Enterprises
Healthcare
Others
Thermal Management Market By Geography
North America
- U.S
- Canada
Europe
- UK
- Germany
- France
- Spain
- Rest of Europe
Asia-Pacific
- China
- Japan
- India
- Australia
- South Korea
- Rest of Asia-Pacific
Latin America
- Brazil
- Mexico
- Rest of Latin America
Middle East & Africa
- GCC
- South Africa
- Rest of Middle East & Africa
Frequently Asked Questions
The market value of thermal management is anticipated to be around US$ 15,000 Mn in 2027.
It is anticipated to grow around 8% CAGR amid the forecast period.2020-2027
North America held maximum share in 2019.
Asia Pacific is projected to grow at a fast pace during forecast period from 2020-2027.
Increasing use of electronic devices in different end-use industries is expected to drive the growth of the thermal management market.
Design complexities of components used in cooling systems is a major factor expected to restraint the growth of the market.
Honeywell International Inc., PARKER HANNIFIN CORP, Delta Electronics, Inc., Kelvion Holding GmbH, Master Bond Inc., Henkel AG & Co. KGaA, LORD Corporation., Laird, HEATEX AB, AI Technology, Inc., GENTHERM, Miba AG, European Thermodynamics Ltd., INHECO Industrial Heating & Cooling GmbH, Boyd Corporation, ThermoTek, API Heat Transfer, Vertiv Group Corp., Aismalibar, Cool Innovations, and others are the prominent players in the thermal management market.
