Soldering Flux Paste Market Analysis - Global Industry Size, Share, Trends and Forecast, 2018 - 2026

Category : Chemicals and Materials | Delivery Format : PDF | Status: Forthcoming | Report ID : ARC572

Introduction

A solder paste is a powder metal solder suspended in a thick medium – flux that acts as a temporary adhesive. Soldering flux paste are made of rosin, organic materials, resins and various levels of solid residues. The market for soldering flux paste has witnessed significant growth due to rising demand from various applications such as SMT assembly, semiconductor packaging and industrial soldering. The major factors driving the growth of market include increase in demand of solder flux paste based products that provide surface protection from re-oxidation of products across end use industries.

Market Dynamics

The growing demand for solder paste that provides efficient soldering results with broad process windows and post-process residues that are cleanable in saponified water have led to the growth of soldering flux paste market globally. Increased use of soldering flux paste in electronics & semiconductor sector is expected to change the dynamics of market in near future. However, growing opportunities across Asia-Pacific market; as well as growing semiconductor and printed circuit board industry are major opportunity areas for the market players. The major challenges faced by market include limited availability of clean assembly and inert flow environment for no-clean flux, risk of exposure of the soldered particles, and transportation process complexity of solder paste.

Market Classification and Overview

The soldering flux paste market is bifurcated on the basis of type, application, end use industry, and geography. The different types of soldering flux paste include rosin based paste, water soluble paste, and no-clean flux among others. Rosin based paste is the largest and most mature market segment as it caters to almost every type of application. No-clean flux is the fastest growing market segment owing to its ability to save cleaning costs, capital expenditures and floor space in comparison with other types. Based on application, the market is segmented into SMT assembly, semiconductor packaging, and industrial soldering among others. SMT assembly is the fastest growing application segment owing to the increasing demand of miniaturized components in consumer electronics. Based on end use industry, the market is further segmented into electronics & semiconductor, automotive, industrial and others. Electronics & semiconductor accounts for majority of the global consumption of soldering flux paste market and led the global soldering flux paste market followed by automotive and industrial segments. Automotive is the fastest growing market owing to increase in demand for long-term reliable and high performance based soldering paste in automotive electronics systems.

Regional Overview

The market for soldering flux paste is segmented into regions such as North America, Europe, Asia-Pacific, Latin America, and Middle-East and Africa (MEA). Asia-Pacific was the major contributors to the growth of soldering flux paste market in 2015. Europe was the second biggest market followed by North America. The market for soldering flux paste in Asia-Pacific is further projected to witness highest growth in coming years owing to rapidly changing lifestyles and fast growth of automotive and electronic industries in the region. The Europe market for soldering flux paste is likely to grow at a significant rate owing to the increase in demand from electronic and industrial soldering applications.

Report Coverage

Market

Soldering Flux Paste Market

Analysis Period

2015 – 2026

Historic Data

2015 – 2016

Base Year

2017

Forecast Data

2018 – 2026

Market Stratification

Type, Application, End-Use Industry, Geography

Regional Scope

North America, Europe, Asia-Pacific, Latin America, Middle East and Africa (MEA)

Report Coverage

Market Trends, Drivers, Restraints, Porter's Five Forces Analysis, Competitive Analysis,

Player Profiling, Value Chain Analysis

Market Participants

Senju Metal Industry Co., Ltd., Alpha Assembly Solutions, Shengmao Technology Inc., Tamura Corporation, Henkel Electronics Materials, Kester, Indium Corporation, Inventec (Avantec) Performance Chemicals, KOKI Company Ltd., AIM Metals & Alloys LP, La-Co Industries, Inc., Nihon Superior Co., Ltd., Kawada, Yashida Solder Paste, Tongfang Tech, Shenzen Bright Soldering Tin Product Co., Ltd., Shenzen Tongfang Electronic New Material Co., and Yong An Technology are some of the key players operating in the global soldering flux paste market.

Market Segmentation

Market By Type

·         Rosin Based Paste

·         Water Soluble Paste

·         No-Clean Flux

Market By Application

·         SMT Assembly

·         Semiconductor Packaging

·         Industrial Soldering

·         Others

Market By End-Use Industry

·         Electronics & Semiconductor

·         Automotive

·         Industrial

·         Others

Market By Geography

·         North America

o   US

o   Canada

o   Mexico

·         Europe

o   UK

o   Germany

o   France

o   Rest of Europe

·         Asia-Pacific

o   China

o   Japan

o   India

o   Australia

o   Rest of Asia-Pacific

·         Latin America

o   Brazil

o   Rest of Latin America

·         Middle East and Africa (MEA)

o   South Africa

o   Saudi Arabia

o   Rest of MEA


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